PROTECTIVE PAK

Removal leaves little or no residue   Masking off PCBs for IR reflow ovens or wave soldering under 572�F (300�C) ~ 10 seconds   Near zero voltage generation when tape removed from PCB (at 50% relative humidity)   Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)   Low sloughing plastic core   Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits   For best results, apply to board using a rubber roller   1.0 mil thick (0.0254 mm) polyimide film (DuPont® Kapton or equivalent)   1.4 mil thick (0.0356 mm) conductive polysiloxide adhesive   Adhesive surface resistivity 10E3 to 10E4 ohms   Max temperature 300�C (572�F), 10 seconds   Lead-free RoHS compliant