PCB changed | 2 |
HTS | 8541.10.00.80 |
ECCN (US) | EAR99 |
Maximum Power Dissipation (mW) | 150 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 100 |
Supplier Package | DIL |
Package Height | 2.2(Max) |
Photodiode Material | Si |
Polarity | Reverse |
Maximum Reverse Voltage (V) | 32 |
Photodiode Type | PIN |
EU RoHS | Compliant |
Maximum Dark Current (nA) | 30 |
Maximum Forward Voltage (V) | 1.3 |
Maximum Rise Time (ns) | 20 |
Maximum Fall Time (ns) | 20 |
Package Length | 4.5(Max) |
Standard Package Name | DIP |
Pin Count | 2 |
Mounting | Through Hole |
Type | Chip |
Lead Shape | Through Hole |
Part Status | Active |
Peak Wavelength (nm) | 880 |
Package Width | 4(Max) |
Photo Sensitivity | 0.65A/W |
Maximum Light Current (uA) | 50 |