| PCB changed | 2 |
| HTS | 8541.40.60.10 |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 150 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | DIL SMT |
| Package Height | 1.2(Max) |
| Photodiode Material | Si |
| Polarity | Forward |
| Maximum Reverse Voltage (V) | 32 |
| Photodiode Type | PIN |
| EU RoHS | Compliant |
| Maximum Dark Current (nA) | 30 |
| Maximum Forward Voltage (V) | 1.3 |
| Maximum Rise Time (ns) | 25 |
| Maximum Fall Time (ns) | 25 |
| Package Length | 4.5(Max) |
| Standard Package Name | DIP SMD |
| Pin Count | 2 |
| Mounting | Surface Mount |
| Type | Chip |
| Lead Shape | Gull-wing |
| Part Status | LTB |
| Peak Wavelength (nm) | 850 |
| Package Width | 4(Max) |
| Photo Sensitivity | 0.2A/W |
