| Number of Channels per Chip | 2 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| PCB changed | 8 |
| HTS | 8541.40.80.00 |
| Output Type | DC |
| Maximum Collector-Emitter Voltage (V) | 70 |
| ECCN (US) | EAR99 |
| Current Transfer Ratio Test Current (mA) | 10 |
| Standard | UL |
| Maximum Power Dissipation (mW) | 250 |
| Typical Rise Time (us) | 1.6 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Package | SOIC N |
| Maximum Collector-Emitter Saturation Voltage (mV) | 400 |
| Typical Forward Voltage (V) | 1.25 |
| Package Height | 3.43(Max) |
| Maximum Reverse Voltage (V) | 6 |
| EU RoHS | Compliant |
| Maximum Current Transfer Ratio (%) | 200 |
| Maximum Forward Current (mA) | 60 |
| Output Device | Transistor |
| Maximum Forward Voltage (V) | 1.55 |
| Input Type | DC |
| Maximum Collector Current (mA) | 150 |
| Typical Fall Time (us) | 2.2 |
| Package Length | 5.13(Max) |
| Standard Package Name | SOP |
| Pin Count | 8 |
| Mounting | Surface Mount |
| Minimum Current Transfer Ratio (%) | 100 |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Packaging | Tape and Reel |
| Package Width | 4.16(Max) |
