Maximum Propagation Delay Time @ Maximum CL (ns) | 300@5V|130@10V|100@15V |
PCB changed | 14 |
HTS | 8542.39.00.01 |
Maximum Quiescent Current (uA) | 1 |
Number of Elements per Chip | 3 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 125 |
Supplier Package | PDIP |
Maximum High Level Output Current (mA) | -4.2(Min) |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 300 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | NAND |
Package Height | 4.95(Max) |
Number of Element Outputs | 1 |
Maximum Operating Supply Voltage (V) | 18 |
EU RoHS | Not Compliant |
Number of Selection Inputs per Element | 0 |
Typical Quiescent Current (uA) | 0.0015 |
Number of Element Inputs | 3-IN |
Package Length | 19.69(Max) |
Standard Package Name | DIP |
Maximum Low Level Output Current (mA) | 4.2(Min) |
Pin Count | 14 |
Mounting | Through Hole |
Number of Output Enables per Element | 0 |
Lead Shape | Through Hole |
Part Status | Obsolete |
Packaging | Rail |
Typical Operating Supply Voltage (V) | 12|15|5|3.3|9 |
Logic Family | CD4000 |
Package Width | 7.11(Max) |
Minimum Operating Supply Voltage (V) | 3 |