Number of Channels per Chip | 1 |
Minimum Isolation Voltage (Vrms) | 5250 |
PCB changed | 6 |
HTS | 8541.40.80.00 |
Output Type | DC |
Maximum Collector-Emitter Voltage (V) | 70 |
ECCN (US) | EAR99 |
Current Transfer Ratio Test Current (mA) | 10 |
Standard | UL |
Maximum Power Dissipation (mW) | 250 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 100 |
Supplier Package | PDIP SMD White |
Maximum Collector-Emitter Saturation Voltage (mV) | 400 |
Typical Forward Voltage (V) | 1.35 |
Package Height | 3.53(Max) |
Maximum Reverse Voltage (V) | 6 |
EU RoHS | Compliant |
Maximum Current Transfer Ratio (%) | 200 |
Maximum Forward Current (mA) | 60 |
Output Device | Transistor |
Maximum Forward Voltage (V) | 1.65 |
Input Type | DC |
Minimum Forward Voltage (V) | 1 |
Maximum Rise Time (us) | 6 |
Maximum Collector Current (mA) | 50 |
Package Length | 8.89(Max) |
Standard Package Name | DIP |
Pin Count | 6 |
Mounting | Surface Mount |
Maximum Fall Time (us) | 24 |
Minimum Current Transfer Ratio (%) | 100 |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Bag |
Package Width | 6.6(Max) |