Number of Channels per Chip | 8 |
Number of Output Enables per Chip | 2 Low |
Maximum Propagation Delay Time @ Maximum CL (ns) | 9@5V |
PCB changed | 20 |
HTS | 8542.39.00.01 |
Output Type | 3-State |
Maximum Quiescent Current (uA) | 4 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | TSSOP |
Maximum High Level Output Current (mA) | -24 |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 10.5 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | Buffer/Line Driver |
Package Height | 0.9 |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 5.5 |
Number of Inputs per Chip | 8 |
Number of Outputs per Chip | 8 |
Package Length | 6.5 |
Standard Package Name | SOP |
Maximum Low Level Output Current (mA) | 24 |
Pin Count | 20 |
Mounting | Surface Mount |
Number of Input Enables per Chip | 0 |
Input Signal Type | Single-Ended |
欧盟限制某些有害物质的使用 | Compliant |
Bus Hold | No |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 5 |
Logic Family | ACT |
Package Width | 4.4 |
Minimum Operating Supply Voltage (V) | 4.5 |