Number of Channels per Chip | 8 |
Number of Output Enables per Chip | 2 Low |
Maximum Propagation Delay Time @ Maximum CL (ns) | 110@2V|22@4.5V|19@6V |
PCB changed | 20 |
Output Type | 3-State |
Maximum Quiescent Current (uA) | 8 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Maximum Power Dissipation (mW) | 500 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Supplier Package | SO |
Maximum High Level Output Current (mA) | -7.8 |
Process Technology | CMOS |
Absolute Propagation Delay Time (ns) | 225 |
Propagation Delay Test Condition (pF) | 50 |
Logic Function | Buffer/Line Driver |
Package Height | 2.45(Max) |
Polarity | Non-Inverting |
Maximum Operating Supply Voltage (V) | 6 |
EU RoHS | Compliant |
Number of Inputs per Chip | 8 |
Number of Outputs per Chip | 8 |
Package Length | 13(Max) |
Maximum Low Level Output Current (mA) | 7.8 |
Pin Count | 20 |
Mounting | Surface Mount |
Number of Input Enables per Chip | 0 |
Input Signal Type | Single-Ended |
Bus Hold | No |
Part Status | Active |
Packaging | Tape and Reel |
Typical Operating Supply Voltage (V) | 5 |
Logic Family | HC |
Package Width | 7.6(Max) |
Minimum Operating Supply Voltage (V) | 2 |