| Number of Channels per Chip | 2 |
| Power Supply Type | Dual |
| PCB changed | 8 |
| Maximum Input Offset Voltage (mV) | 6@±15V |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 500 |
| Maximum Input Offset Current (uA) | 0.2@±15V |
| Minimum CMRR Range (dB) | 70 to 71 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | PDIP |
| Process Technology | Bipolar |
| Typical Gain Bandwidth Product (MHz) | 10 |
| Typical Voltage Gain (dB) | 100 |
| Package Height | 3.4 |
| EU RoHS | Compliant |
| Maximum Dual Supply Voltage (V) | ±18 |
| Maximum Input Bias Current (uA) | 0.5@±15V |
| Typical Slew Rate (V/us) | 4@±15V |
| Package Length | 8.8 |
| Minimum Dual Supply Voltage (V) | ±4 |
| Standard Package Name | DIP |
| Maximum Supply Current (mA) | 5.7@±15V |
| Shut Down Support | No |
| Pin Count | 8 |
| Mounting | Through Hole |
| Type | High Gain Amplifier |
| Typical Dual Supply Voltage (V) | ±12|±5|±15|±9 |
| Lead Shape | Through Hole |
| Part Status | LTB |
| Manufacturer Type | High Gain Amplifier |
| Package Width | 6.4 |
| Minimum CMRR (dB) | 70 |
