| Density (bit) | 1G |
| Organization | 64Mx16 |
| Package Width (mm) | 9 |
| Data Bus Width (bit) | 16 |
| Number of Internal Banks | 8 |
| Address Bus Width (bit) | 16 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | TFBGA |
| Number of Words per Bank | 8M |
| 印刷电路板已变更 | 96 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| Maximum Clock Rate (MHz) | 1600 |
| Package Height (mm) | 0.8(Max) |
| Maximum Access Time (ns) | 0.225 |
| Standard Package Name | BGA |
| Pin Count | 96 |
| Mounting | Surface Mount |
| Type | DDR3 SDRAM |
| 欧盟限制某些有害物质的使用 | Compliant |
| Package Length (mm) | 13 |
| Lead Shape | Ball |
| Typical Operating Supply Voltage (V) | 1.5 |
| Maximum Operating Current (mA) | 140 |
| Minimum Operating Supply Voltage (V) | 1.425 |
