Typical Input Capacitance @ Vds (pF) | 38@10V |
Configuration | Dual |
Typical Turn-Off Delay Time (ns) | 9 |
PCB changed | 6 |
HTS | 8541.29.00.95 |
Maximum Gate Source Leakage Current (nA) | 100 |
Number of Elements per Chip | 2 |
ECCN (US) | EAR99 |
Typical Rise Time (ns) | 3 |
Maximum Power Dissipation (mW) | 420 |
Channel Mode | Enhancement |
Typical Turn-On Delay Time (ns) | 2 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 150 |
Supplier Package | TSSOP |
Maximum IDSS (uA) | 1 |
Typical Fall Time (ns) | 4 |
Process Technology | TMOS |
Package Height | 1(Max) |
Channel Type | N |
EU RoHS | Compliant |
Maximum Continuous Drain Current (A) | 0.32 |
Maximum Drain Source Voltage (V) | 60 |
Maximum Gate Source Voltage (V) | ±20 |
Maximum Drain Source Resistance (mOhm) | 1600@10V |
Package Length | 2.2(Max) |
Pin Count | 6 |
Mounting | Surface Mount |
Part Status | Active |
Product Category | Small Signal |
Packaging | Tape and Reel |
Maximum Gate Threshold Voltage (V) | 1.5 |
Package Width | 1.35(Max) |
Typical Gate Charge @ Vgs (nC) | 0.72@4.5V |