Pitch - Mating Interface | 2.54mm |
Polarized to Mating Part | No |
Shrouded | No |
UPC | 800756748931 |
PCB Retention | None |
Voltage - Maximum | 250V |
Polarized to PCB | No |
ELV | Not Relevant |
Keying to Mating Part | None |
Process Temperature max. C | 260 |
Plating min - Mating | 2.540µm |
Breakaway | Yes |
Material - Plating Mating | Tin |
Lead-freeProcess Capability | WAVE |
Color - Resin | Black |
Mated Height | 7.00mm |
Status | Contact Molex |
First Mate / Last Break | No |
RoHS Phthalates | Not Contained |
Material - Resin | High Temperature Thermoplastic |
Lock to Mating Part | None |
Sales Drawing | SD-87914-013-000 |
Glow-Wire Compliant | No |
Product Family | PCB Headers |
Orientation | Vertical |
Material - Metal | Copper Alloy |
Surface Mount Compatible (SMC) | Yes |
Circuits (Loaded) | 52 |
Material - Plating Termination | Nickel |
Stackable | No |
Application | Wire-to-Board |
Description | 2.54mm Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 2.50µm Tin (Sn) Selective Plating, 52 Circuits, Bag Packaging, Lead-Free |
Part Number | 0879145226 |
Termination Interface: Style | Through Hole |
Current - Maximum per Contact | 3.0A |
Duration at Max. Process Temperature (seconds) | 010 |
Mates With | Link:7859 Shunts|Link:71850 C-Grid® PCB Receptacles|Link:70450 SL™ IDT Housing |
PCB Thickness - Recommended | 1.60mm |
PCB Locator | No |
HFLH | Low-Halogen |
Max. Cycles at Max. Process Temperature | 003 |
Plating min - Termination | 1.270µm |
RoHS Status | Compliant |
Circuits (maximum) | 52 |
Reach | Not Contained Per -ED/01/2017 (12 January 2017) |
Number of Rows | 2 |
Packaging Type | Bag |
Product Name | C-Grid® |
Overview | cgrid__sl_products |
China ROHS | Not Relevant |
Series | 87914 |
Guide to Mating Part | No |
Pitch - Termination Interface | 2.54mm |
Net Weight | 3.158/g |
PC Tail Length | 2.96mm |
Country of Origin | MY |
Temperature Range - Operating | -55°C to +105°C |