Pitch - Mating Interface | 2.54mm |
UPC | 800753874237 |
Number of Pairs | Open Pin Field |
PCB Retention | None |
Voltage - Maximum | 250V AC (RMS) |
Polarized to PCB | No |
ELV | Not Relevant |
Keying to Mating Part | None |
Durability (mating cycles max) | 400 |
UL | E29179 |
Process Temperature max. C | 260 |
Plating min - Mating | 0.610µm |
Material - Plating Mating | Gold |
Lead-freeProcess Capability | WAVE |
Color - Resin | Gray |
Status | New Business Not Supported |
First Mate / Last Break | No |
RoHS Phthalates | Not Contained |
Material - Resin | Polyester |
Product Specification | PS-85013-0002 |
Sales Drawing | 612-6043-202-003 |
Product Family | Backplane Connectors |
Orientation | Vertical |
Material - Metal | Phosphor Bronze |
Number of Columns | 16 |
Circuits (Loaded) | 32 |
Material - Plating Termination | Tin |
Application | Backplane |
Description | 2.54mm Pitch DIN 41612 Header, C-Pin Press-Fit Style Q/2 Reverse, Vertical , Through Hole , 0.60µm Selective Gold (Au) , 32 Circuits |
Part Number | 0850110036 |
CSA | LR19980 |
Termination Interface: Style | Through Hole - Compliant Pin |
Current - Maximum per Contact | 1.5A |
Duration at Max. Process Temperature (seconds) | 010 |
Component Type | PCB Header |
Mates With | DIN 41612/IEC 603-2 Mixed Layout Connector Link:85048|Link:85056 |
Data Rate | 622.0 Mbps |
PCB Thickness - Recommended | 1.60mm |
Style | Q/2 |
PCB Locator | No |
HFLH | Not Low-Halogen |
Replacement Part Number | Contact Molex |
Plating min - Termination | 0.406µm |
RoHS Status | Compliant |
Circuits (maximum) | 32 |
Reach | Not Contained Per -ED/01/2017 (12 January 2017) |
Number of Rows | 2 |
Packaging Type | Bag |
Product Name | IEC 603-2/DIN 41612 |
Overview | din_41612 |
China ROHS | Green Image |
Series | 85011 |
Guide to Mating Part | No |
Pitch - Termination Interface | 2.54mm |
Flammability | 94V-0 |
Net Weight | 5.927/g |
PC Tail Length | 3.00mm |
Country of Origin | JP |
Temperature Range - Operating | -55°C to +125°C |