| Pitch - Mating Interface | 2.54mm |
| Polarized to Mating Part | Center Slot |
| Shrouded | Fully |
| UPC | 822348487004 |
| PCB Retention | None |
| Voltage - Maximum | 250V DC |
| Polarized to PCB | No |
| ELV | Not Relevant |
| Keying to Mating Part | None |
| UL | E29179 |
| Process Temperature max. C | 235 |
| Plating min - Mating | 0.381µm |
| Breakaway | No |
| Material - Plating Mating | Gold |
| Lead-freeProcess Capability | WAVE |
| Status | Active |
| First Mate / Last Break | No |
| RoHS Phthalates | Not Contained |
| Lock to Mating Part | None |
| Sales Drawing | SDA-70246-**20-25_39 |
| Glow-Wire Compliant | No |
| Product Family | PCB Headers |
| Orientation | Vertical |
| Surface Mount Compatible (SMC) | No |
| Circuits (Loaded) | 8 |
| Material - Plating Termination | Tin |
| Stackable | No |
| Application | Wire-to-Board |
| Description | 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 8 Circuits, 0.38µm Gold (Au) Selective Plating |
| Part Number | 0702460801 |
| CSA | LR19980 |
| Termination Interface: Style | Through Hole |
| Current - Maximum per Contact | 2.5A |
| Duration at Max. Process Temperature (seconds) | 010 |
| Mates With | Link:70450 SL™ Crimp Housing|Link:70058 SL™ Crimp Terminal |
| PCB Thickness - Recommended | 1.60mm |
| PCB Locator | No |
| HFLH | Not Low-Halogen |
| Max. Cycles at Max. Process Temperature | 001 |
| Plating min - Termination | 1.905µm |
| RoHS Status | Compliant |
| Circuits (maximum) | 8 |
| Reach | Not Contained Per -ED/01/2017 (12 January 2017) |
| Number of Rows | 2 |
| Packaging Type | Tray |
| Product Name | C-Grid® |
| Overview | cgrid__sl_products |
| China ROHS | Green Image |
| Series | 70246 |
| Guide to Mating Part | No |
| Pitch - Termination Interface | 2.54mm |
| Flammability | 94V-0 |
| Net Weight | 1.258/g |
| Packaging Specification | PK-87835-001 |
| PC Tail Length | 3.43mm |
| Country of Origin | SG |
| Temperature Range - Operating | -55°C to +120°C |
