| Pitch - Mating Interface | 1.27mm |
| Description | 1.27mm Pitch, ZIF Micro PGA Socket, 478 Circuits with Ball Grid Array (BGA) Solder, 0.381µm Gold (Au) Plating |
| Part Number | 0547624784 |
| UPC | 800756498645 |
| Voltage - Maximum | 100V |
| ELV | Product not active |
| Termination Interface: Style | Surface Mount |
| Current - Maximum per Contact | 0.5A |
| Component Type | Socket |
| Mates With | Intel Pentium* 4 Processor |
| Durability (mating cycles max) | 50 |
| Plating min - Mating | 0.381µm |
| Material - Plating Mating | Gold |
| HFLH | Product not active |
| Obsolete Date | 2006/07/01 |
| Replacement Part Number | Contact Molex |
| Plating min - Termination | 1.270µm |
| RoHS Status | Product not active |
| Color - Resin | Natural |
| Status | Obsolete |
| Reach | Product not active |
| RoHS Phthalates | Product not active |
| Material - Resin | High Temperature Thermoplastic |
| Comments | ZIF, with Pick and Place Cover |
| Packaging Type | Tray |
| Product Name | Micro PGA |
| Product Family | Processor Sockets |
| Trademark Attribution | * Pentium is registered trademark of Intel Corporation |
| Material - Metal | Copper-Nickel-Silicon |
| China ROHS | Product not active |
| Series | 54762 |
| Circuits (Loaded) | 478 |
| Material - Plating Termination | Nickel |
| Country of Origin | SG |
| Temperature Range - Operating | -20°C to +90°C |
