Fabrication Technology | 130nm |
Program Memory Type | Flash |
Package Width (mm) | 23 |
Maximum Number of User I/Os | 204 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 125 |
Supplier Package | FBGA |
印刷电路板已变更 | 484 |
RAM Bits | 64 |
Family Name | SmartFusion |
Maximum Operating Supply Voltage (V) | 1.575 |
Device Logic Gates | 500000 |
Main Family Name | SmartFusion |
Package Height (mm) | 1.73 |
Device Number of DLLs/PLLs | 2 |
Device System Gates | 500000 |
Standard Package Name | BGA |
Pin Count | 484 |
Mounting | Surface Mount |
欧盟限制某些有害物质的使用 | Compliant |
Package Length (mm) | 23 |
Ethernet MACs | 1 |
Lead Shape | Ball |
Typical Operating Supply Voltage (V) | 1.5 |
Number of Registers | 11520 |
Maximum Internal Frequency (MHz) | 100 |
Temperature Grade | Military |
Programmability | Yes |