| Organization | 256Mx32 |
| PCB changed | 170 |
| ECCN (US) | EAR99 |
| Data Bus Width (bit) | 32 |
| Number of Internal Banks | 16 |
| Address Bus Width (bit) | 17 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Package | FBGA |
| DRAM Type | GDDR5 SGRAM |
| Chip Density (bit) | 8G |
| Number of Words per Bank | 16M |
| Package Height | 0.87 |
| EU RoHS | Compliant |
| Interface Type | POD_15 |
| Number of Bits/Word (bit) | 32 |
| Number of I/O Lines (bit) | 32 |
| Supplier Temperature Grade | Commercial |
| Package Length | 14 |
| Standard Package Name | BGA |
| Pin Count | 170 |
| Mounting | Surface Mount |
| Lead Shape | Ball |
| Part Status | Obsolete |
| Typical Operating Supply Voltage (V) | 1.5|1.35 |
| Package Width | 12 |
