Organization | 16Mx16 |
PCB changed | 54 |
HTS | 8542.32.00.24 |
ECCN (US) | EAR99 |
Data Bus Width (bit) | 16 |
Number of Internal Banks | 4 |
Operating Current (mA) | 100 |
Address Bus Width (bit) | 15 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Supplier Package | TSOP-II |
DRAM Type | SDR SDRAM |
Chip Density (bit) | 256M |
Number of Words per Bank | 4M |
Process Technology | CMOS |
Package Height | 1(Max) |
Maximum Operating Supply Voltage (V) | 3.6 |
Maximum Clock Rate (MHz) | 167 |
EU RoHS | Compliant |
Maximum Access Time (ns) | 17|5.4|7.5 |
Interface Type | LVTTL |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Commercial |
Package Length | 22.22 |
Pin Count | 54 |
Mounting | Surface Mount |
Part Status | Unconfirmed |
Typical Operating Supply Voltage (V) | 3.3 |
Package Width | 10.16 |
Minimum Operating Supply Voltage (V) | 3 |