PIC16F1459-I/ML 规格参数
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| Core Processor | PIC |
| PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 |
| Program Memory Type | FLASH |
| Online Catalog | PIC® XLP16F/LF |
| Supplier Device Package | 20-QFN (4x4) |
| PCN Design/Specification | PIC16(L)F145x, Family Errata/Datasheet 18/May/2013 PIC16(L)F1454,5,9 Errata and Datasheet 16/Oct/2013 PIC16(L)F1454,5,9 Datasheet Update 31/Mar/2014 Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 CuPdAu bond wire 14/Dec/2016 |
| EEPROM Size | - |
| Package / Case | 20-VFQFN Exposed Pad |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 Packing Changes 10/Oct/2016 |
| Manufacturer | Microchip Technology |
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