PIC16C55-LPI/P 规格参数
| PCN Part Status Change | PIC16C55 Migration 01/Aug/2001 |
| Embedded - Microcontrollers | |
| Core Processor | PIC |
| PCN Assembly/Origin | Qualification PDIP-28L/40L 21/Oct/2013 Qualification Assembly Site PDIP-28/40L 23/Aug/2013 Qualification Revision 06/Feb/2014 Qualification Assembly Site 23/May/2014 Qualification Report Revision 23/Sep/2014 |
| Program Memory Type | OTP |
| Supplier Device Package | 28-PDIP |
| PCN Design/Specification | PdCu Bond Wire Update 21/Sep/2015 Wire Chg 13/Jan/2016 |
| EEPROM Size | - |
| Package / Case | 28-DIP (0.600", 15.24mm) |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 Packing Changes 10/Oct/2016 |
| Manufacturer | Microchip Technology |
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