| Typical Input Capacitance @ Vds (pF) | 460@30V |
| Configuration | Dual Dual Drain |
| Typical Turn-Off Delay Time (ns) | 17.4 |
| PCB changed | 8 |
| Maximum Gate Source Leakage Current (nA) | 100 |
| Number of Elements per Chip | 2 |
| ECCN (US) | EAR99 |
| Typical Rise Time (ns) | 24.6 |
| Maximum Power Dissipation (mW) | 2000 |
| Channel Mode | Enhancement |
| Typical Turn-On Delay Time (ns) | 3.8 |
| Automotive | Unknown |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 150 |
| Supplier Package | SOIC |
| Maximum IDSS (uA) | 1 |
| Typical Fall Time (ns) | 10.6 |
| Process Technology | TMOS |
| Package Height | 1.38 |
| Channel Type | N |
| EU RoHS | Compliant |
| Maximum Continuous Drain Current (A) | 7.5 |
| Military | No |
| Maximum Drain Source Voltage (V) | 30 |
| Maximum Gate Source Voltage (V) | ±20 |
| Maximum Drain Source Resistance (mOhm) | 22@10V |
| Package Length | 4.9 |
| Typical Gate Charge @ 10V (nC) | 11.7 |
| Standard Package Name | SOP |
| Pin Count | 8 |
| Mounting | Surface Mount |
| Lead Shape | Gull-wing |
| Part Status | Active |
| Product Category | Power MOSFET |
| Packaging | Tape and Reel |
| Maximum Gate Threshold Voltage (V) | 3 |
| Package Width | 3.9 |
| Typical Gate Charge @ Vgs (nC) | 6.1@4.5V|11.7@10V |
