Program Current (mA) | 30 |
PCB changed | 63 |
HTS | 8542.32.00.71 |
ECCN (US) | 3A991.b.1.a |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 30 |
Address Bus Width (bit) | 28 |
Minimum Operating Temperature (°C) | -40 |
Command Compatible | No |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | VFBGA |
Chip Density (bit) | 1G |
Timing Type | Asynchronous |
Package Height | 0.55(Min) |
Maximum Operating Supply Voltage (V) | 3.6 |
EU RoHS | Compliant |
Maximum Programming Time (ms) | 0.7/Page |
Maximum Erase Time (s) | 0.003/Block |
Interface Type | Parallel |
Sector Size | 128Kbyte x 1024 |
Boot Block | No |
Number of Bits/Word (bit) | 8 |
Number of Words | 128M |
Erase Suspend/Resume Modes Support | No |
ECC Support | Yes |
Architecture | Sectored |
Block Organization | Symmetrical |
Support of Page Mode | No |
Page Size | 2Kbyte |
Support of Common Flash Interface | No |
Supplier Temperature Grade | Industrial |
Package Length | 11 |
Standard Package Name | BGA |
Cell Type | SLC NAND |
Pin Count | 63 |
Mounting | Surface Mount |
Simultaneous Read/Write Support | No |
Max. Access Time (ns) | 25 |
Lead Shape | Ball |
Part Status | NRND |
Typical Operating Supply Voltage (V) | 3.3 |
Package Width | 9 |
Programmability | Yes |
Minimum Operating Supply Voltage (V) | 2.7 |