| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| PCB changed | 6 |
| Output Type | DC |
| Maximum Collector-Emitter Voltage (V) | 30 |
| ECCN (US) | EAR99 |
| Current Transfer Ratio Test Current (mA) | 10 |
| Standard | TUV|UL|DEMKO |
| Maximum Power Dissipation (mW) | 250 |
| Typical Rise Time (us) | 3 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Package | PDIP SMD |
| Maximum Collector-Emitter Saturation Voltage (mV) | 500 |
| Typical Forward Voltage (V) | 1.2 |
| Package Height | 3.5 |
| Maximum Reverse Voltage (V) | 6 |
| EU RoHS | Compliant |
| Maximum Forward Current (mA) | 80 |
| Output Device | Transistor With Base |
| Maximum Forward Voltage (V) | 1.5 |
| Input Type | DC |
| Maximum Collector Current (mA) | 100 |
| Typical Fall Time (us) | 3 |
| Package Length | 7.3 |
| Standard Package Name | DIP |
| Pin Count | 6 |
| Mounting | Surface Mount |
| Minimum Current Transfer Ratio (%) | 20 |
| Lead Shape | Gull-wing |
| Packaging | Tape and Reel |
| Package Width | 6.5 |
