Program Memory Type | SRAM |
PCB changed | 1152 |
HTS | 8542.31.00.01 |
Logic Elements | 67000 |
ECCN (US) | 3A991.d |
SERDES Channels | 16 |
Operating Supply Voltage (V) | 1.2 |
Total Number of Block RAM | 246 |
Dedicated DSP | 24 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | FBGA |
Tradename | LatticeEC |
Number of I/O Banks | 8 |
Device Logic Units | 67000 |
Maximum I/O Performance | 3.125Gbps |
Process Technology | 90nm |
Package Height | 1.75 |
Family Name | LatticeECP2M |
Maximum Operating Supply Voltage (V) | 1.26 |
EU RoHS | Compliant |
I/O Voltage (V) | 1.2|1.5|3.3|2.5|1.8 |
Device Number of DLLs/PLLs | 2+6+2 |
Number of Multipliers | 96 (18x18) |
Maximum Differential I/O Pairs | 218 |
GMACs | 31.2 |
Embedded Memory (Kbit) | 4534 |
Supplier Temperature Grade | Commercial |
Package Length | 35 |
In-System Programmability | Yes |
Standard Package Name | BGA |
Reprogrammability Support | No |
Pin Count | 1152 |
Mounting | Surface Mount |
Lead Shape | Ball |
Part Status | Active |
Copy Protection | No |
Packaging | Tray |
Speed Grade | 7 |
Mega Multiply Accumulates per second | 31200 |
Package Width | 35 |
User I/Os | 436 |
Shift Registers | Utilize LUT |
Maximum Distributed RAM Bits | 148480 |
Programmability | No |
Minimum Operating Supply Voltage (V) | 1.14 |