Typical Input Capacitance @ Vds (pF) | 11560@25V |
Configuration | Single Hex Drain Octal Source |
Typical Turn-Off Delay Time (ns) | 92 |
PCB changed | 9 |
Maximum Gate Source Leakage Current (nA) | 100 |
Number of Elements per Chip | 1 |
ECCN (US) | EAR99 |
Typical Rise Time (ns) | 32 |
Maximum Power Dissipation (mW) | 3300 |
Channel Mode | Enhancement |
Typical Turn-On Delay Time (ns) | 44 |
Automotive | Yes |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 175 |
Supplier Package | Direct-FET |
Maximum IDSS (uA) | 20 |
Typical Fall Time (ns) | 41 |
Process Technology | DirectFET |
Package Height | 0.74(Max) |
Channel Type | N |
EU RoHS | Compliant |
Maximum Continuous Drain Current (A) | 20 |
Military | No |
Maximum Drain Source Voltage (V) | 100 |
Maximum Gate Source Voltage (V) | ±20 |
Maximum Drain Source Resistance (mOhm) | 3.5@10V |
Material | Si |
Supplier Temperature Grade | Automotive |
Package Length | 9.15(Max) |
Typical Gate Charge @ 10V (nC) | 200 |
AEC Qualified Number | AEC-Q101 |
Pin Count | 9 |
Mounting | Surface Mount |
Part Status | Active |
Product Category | Power MOSFET |
Packaging | Tape and Reel |
Maximum Gate Threshold Voltage (V) | 4 |
Package Width | 7.1(Max) |
Typical Gate Charge @ Vgs (nC) | 200@10V |