Organization | 512Kx8 |
PCB changed | 48 |
HTS | 8542.32.00.71 |
ECCN (US) | EAR99 |
Data Bus Width (bit) | 8 |
Operating Current (mA) | 135 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | FBGA |
Chip Density (bit) | 4M |
Density Range (bit) | 256K to 8M |
Package Height | 1.02 |
Maximum Operating Supply Voltage (V) | 3.6 |
EU RoHS | Compliant |
Interface Type | Parallel |
Supplier Temperature Grade | Industrial |
Package Length | 8 |
Standard Package Name | BGA |
Pin Count | 48 |
Mounting | Surface Mount |
Max. Access Time (ns) | 35 |
Lead Shape | Ball |
Part Status | Active |
Packaging | Tray |
Typical Operating Supply Voltage (V) | 3.3 |
Package Width | 8 |
Minimum Operating Supply Voltage (V) | 3 |