Number of Channels per Chip | 1 |
Minimum Isolation Voltage (Vrms) | 5000 |
PCB changed | 4 |
Output Type | DC |
Maximum Collector-Emitter Voltage (V) | 35 |
ECCN (US) | EAR99 |
Current Transfer Ratio Test Current (mA) | 5 |
Standard | CSA|NEMKO|FIMKO|CQC|UL|SEMKO|DEMKO |
Maximum Power Dissipation (mW) | 200 |
Typical Rise Time (us) | 4 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 110 |
Supplier Package | PDIP |
Maximum Collector-Emitter Saturation Voltage (mV) | 200 |
Typical Forward Voltage (V) | 1.2 |
Package Height | 3.5 |
Maximum Reverse Voltage (V) | 6 |
EU RoHS | Compliant |
Maximum Current Transfer Ratio (%) | 600 |
Maximum Forward Current (mA) | 60 |
Output Device | Transistor |
Maximum Forward Voltage (V) | 1.4 |
Input Type | DC |
Maximum Rise Time (us) | 18 |
Maximum Collector Current (mA) | 50 |
Typical Fall Time (us) | 3 |
Package Length | 4.58 |
Standard Package Name | DIP |
Pin Count | 4 |
Mounting | Through Hole |
Maximum Fall Time (us) | 18 |
Minimum Current Transfer Ratio (%) | 50 |
Lead Shape | Through Hole |
Part Status | Active |
Packaging | Tube |
Package Width | 6.5 |