| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| PCB changed | 8 |
| ECCN (US) | EAR99 |
| Standard | NEMKO|FIMKO|VDE|UL|SEMKO|DEMKO |
| Maximum Power Dissipation (mW) | 100 |
| Direction Type | Uni-Directional |
| Typical Rise Time (us) | 0.04 |
| Maximum Data Rate | 10Mbps |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | DIP |
| Typical Forward Voltage (V) | 1.4 |
| Polarity | Inverting |
| Maximum Reverse Voltage (V) | 5 |
| EU RoHS | Compliant |
| Maximum Forward Current (mA) | 50 |
| Maximum Forward Voltage (V) | 1.8 |
| Input Type | DC |
| Maximum Propagation Delay Time (ns) | 75 |
| Logic Gate Type | NAND |
| Typical Fall Time (us) | 0.01 |
| Package Length | 9.76 |
| Standard Package Name | DIP |
| Pin Count | 8 |
| Mounting | Through Hole |
| Lead Shape | Through Hole |
| Part Status | Active |
| Maximum Continuous Output Current (mA) | 50 |
| Packaging | Tube |
| Package Width | 6.6 |
