| Configuration | 5 x 1:1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 0.25(Typ)@5V |
| PCB changed | 24 |
| HTS | 8542.39.00.01 |
| Maximum Quiescent Current (uA) | 3 |
| Number of Elements per Chip | 2 |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Package | QSOP |
| Maximum High Level Output Current (mA) | -120 |
| Process Technology | CMOS |
| Absolute Propagation Delay Time (ns) | 6.5 |
| Propagation Delay Test Condition (pF) | 50 |
| Logic Function | Bus Switch |
| Package Height | 1.65(Max) |
| Maximum Operating Supply Voltage (V) | 5.25 |
| EU RoHS | Compliant |
| Maximum On Resistance (Ohm) | 10(Typ) |
| Typical Quiescent Current (uA) | 0.1 |
| Number of Inputs per Chip | 10 |
| Number of Outputs per Chip | 10 |
| Package Length | 8.66 |
| Standard Package Name | SOP |
| Maximum Low Level Output Current (mA) | 120 |
| Pin Count | 24 |
| Mounting | Surface Mount |
| Part Status | Active |
| Packaging | Tube |
| Typical Operating Supply Voltage (V) | 5 |
| Package Width | 3.91 |
| Minimum Operating Supply Voltage (V) | 4.75 |
