| Number of Channels per Chip | 6 |
| Number of Output Enables per Chip | 0 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 2.5@5V|3.5@3.3V|4@2.7V |
| PCB changed | 14 |
| Output Type | Open Drain |
| Maximum Quiescent Current (uA) | 40 |
| Number of Elements per Chip | 6 |
| ECCN (US) | EAR99 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Package | TSSOP |
| Process Technology | CMOS |
| Absolute Propagation Delay Time (ns) | 7.6 |
| Propagation Delay Test Condition (pF) | 50 |
| Logic Function | Buffer/Driver |
| Package Height | 1.05(Max) |
| Polarity | Non-Inverting |
| Maximum Operating Supply Voltage (V) | 5.5 |
| EU RoHS | Compliant |
| Tolerant I/Os (V) | 5.5 Inputs |
| Number of Inputs per Chip | 6 |
| Number of Outputs per Chip | 6 |
| Package Length | 5.1(Max) |
| Maximum Low Level Output Current (mA) | 32 |
| Pin Count | 14 |
| Mounting | Surface Mount |
| Number of Input Enables per Chip | 0 |
| Input Signal Type | Single-Ended |
| Bus Hold | No |
| Part Status | Active |
| Packaging | Tape and Reel |
| Typical Operating Supply Voltage (V) | 5|3.3|2.5|1.8 |
| Logic Family | LVC |
| Package Width | 4.5(Max) |
| Minimum Operating Supply Voltage (V) | 1.65 |
