Program Current (mA) | 30 |
PCB changed | 48 |
HTS | 8542.32.00.71 |
ECCN (US) | EAR99 |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 12 |
Address Bus Width (bit) | 21/20 |
Minimum Operating Temperature (°C) | -40 |
Command Compatible | Yes |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | TSOP |
Chip Density (bit) | 16M |
Process Technology | 110nm |
Timing Type | Asynchronous |
Package Height | 1 |
Maximum Operating Supply Voltage (V) | 3.6 |
EU RoHS | Compliant |
Maximum Programming Time (ms) | 160000/Chip |
Maximum Erase Time (s) | 10/Sector |
Interface Type | Parallel |
Sector Size | 16Kbyte x 1|8Kbyte x 2|32Kbyte x 1|64Kbyte x 31 |
Boot Block | Yes |
Number of Bits/Word (bit) | 8/16 |
Number of Words | 2M/1M |
Erase Suspend/Resume Modes Support | Yes |
Location of Boot Block | Bottom |
ECC Support | No |
Architecture | Sectored |
Block Organization | Asymmetrical |
OE Access Time (ns) | 30 |
Support of Page Mode | No |
Minimum Endurance (Cycles) | 100000(Typ) |
Support of Common Flash Interface | Yes |
Supplier Temperature Grade | Industrial |
Package Length | 12 |
Standard Package Name | SOP |
Cell Type | NOR |
Pin Count | 48 |
Mounting | Surface Mount |
Simultaneous Read/Write Support | No |
Max. Access Time (ns) | 70 |
Lead Shape | Gull-wing |
Part Status | Active |
Packaging | Tray |
Typical Operating Supply Voltage (V) | 3|3.3 |
Package Width | 18.4 |
Programmability | Yes |
Minimum Operating Supply Voltage (V) | 2.7 |