| PCB changed | 165 |
| HTS | 8542.32.00.41 |
| ECCN (US) | 3A991.b.2.a |
| Operating Current (mA) | 850 |
| Address Bus Width (bit) | 38 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Package | FBGA |
| Chip Density (bit) | 36M |
| Data Rate Architecture | QDR |
| Number of Ports | 2 |
| Timing Type | Synchronous |
| Package Height | 0.89 |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Maximum Clock Rate (MHz) | 300 |
| EU RoHS | Compliant |
| Number of Words | 1M |
| Number of Bits/Word (bit) | 36 |
| Architecture | Pipelined |
| Supplier Temperature Grade | Commercial |
| Package Length | 15 |
| Standard Package Name | BGA |
| Pin Count | 165 |
| Mounting | Surface Mount |
| Max. Access Time (ns) | 0.45 |
| Lead Shape | Ball |
| Part Status | Active |
| Packaging | Tray |
| Typical Operating Supply Voltage (V) | 1.8 |
| Package Width | 13 |
| Minimum Operating Supply Voltage (V) | 1.7 |
