CW2400 规格参数
Applications: | Conductive Bonds Between Heat Sensitive Components, Solderless Surface Mount Connections, Circuit Board Trace Repair, Static Discharge and Grounding, Solder Repair, Conductive Structural Adhesions |
Hardness: | >70Shore D |
Minimum Operating Temperature: | -131°F |
Container Type: | Syringe |
Maximum Operating Temperature: | +212°F |
Gel Time: | 8 to 10min |
Product Type: | Epoxy Adhesive |
Brand Name: | CircuitWorks |
Chemical Composition: | Part A:Silver, Reaction Product:Bisphenol-A-(Epichlorhydrin), Epoxy Resin|Part B:Silver, 3,6-Diazaoctanethylenediamin |
Odor: | Part A:Mild Amine|Part B:Amine |
Specific Gravity: | 4 |