IM03GR 规格参数
| DIP Package Style | Slim line & low profile | 
| Approx. Dimensions (L x W x H) (mm [in]) | 10.00 x 6.00 x 5.65 [.394 x .236 x .222] | 
| Coil Suppression Diode | Without | 
| Approved Standards | CECC Approved, CSA Certified, IEC60950, UL Recognized, UL1950 | 
| Contact Type | Bifurcated | 
| Polarized | Yes | 
| Enclosure | Immersion Cleanable | 
| Lead Free Solder Processes | Reflow solder capable to 245°C, Reflow solder capable to 260°C | 
| Termination Type | SMT, Gull Wing | 
| Pin Configuration | DIP | 
| Contact Material | Palladium Ruthenium, Gold Overlay | 
数据手册
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