IM03GR 规格参数
DIP Package Style | Slim line & low profile |
Approx. Dimensions (L x W x H) (mm [in]) | 10.00 x 6.00 x 5.65 [.394 x .236 x .222] |
Coil Suppression Diode | Without |
Approved Standards | CECC Approved, CSA Certified, IEC60950, UL Recognized, UL1950 |
Contact Type | Bifurcated |
Polarized | Yes |
Enclosure | Immersion Cleanable |
Lead Free Solder Processes | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
Termination Type | SMT, Gull Wing |
Pin Configuration | DIP |
Contact Material | Palladium Ruthenium, Gold Overlay |
数据手册
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