| Product Attributes Select All |
| Category | Connectors, Interconnects |
| Online Catalog | X55X Series |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Contact Finish Thickness - Mating | 200µin (5.08µm) |
| Material Flammability Rating | UL94 V-0 |
| Pitch - Post | 0.100" (2.54mm) |
| Manufacturer | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Closed Frame |
| Contact Resistance | - |
| Contact Finish - Mating | Tin |
| Other Names | 48655410 A308 |
| Operating Temperature | - |
| Contact Material - Post | Beryllium Copper |
| Datasheets | 55 Series |
| Current Rating | 1A |
| Termination | Solder |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 48 (2 x 24) |
| Standard Package | 6 |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Series | 55 |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Contact Finish - Post | Tin |
| Packaging | Bulk |
| Part Status | Active |
| Family | Sockets for ICs, Transistors |
| Contact Material - Mating | Beryllium Copper |
| Termination Post Length | 0.110" (2.78mm) |
