| Product Attributes Select All |
| Category | Connectors, Interconnects |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Finish Thickness - Mating | 30µin (0.76µm) |
| Material Flammability Rating | UL94 V-0 |
| Pitch - Post | 0.100" (2.54mm) |
| Manufacturer | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Closed Frame, Elevated |
| Contact Resistance | - |
| Contact Finish - Mating | Gold |
| Operating Temperature | -55°C ~ 105°C |
| Contact Material - Post | Brass |
| Datasheets | 8 Series Elevator Skt .300/.600 |
| Current Rating | 3A |
| Termination | Solder |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Standard Package | 1 |
| Contact Finish Thickness - Post | 10µin (0.25µm) |
| Series | 8 |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Contact Finish - Post | Gold |
| Packaging | Bulk |
| Part Status | Active |
| Family | Sockets for ICs, Transistors |
| Contact Material - Mating | Beryllium Copper |
| Termination Post Length | 0.140" (3.56mm) |
