| Product Attributes Select All |
| Category | Connectors, Interconnects |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Contact Finish Thickness - Mating | 10µin (0.25µm) |
| Material Flammability Rating | UL94 V-0 |
| Pitch - Post | 0.100" (2.54mm) |
| Manufacturer | Aries Electronics |
| Pitch - Mating | 0.100" (2.54mm) |
| Features | Open Frame |
| Contact Resistance | - |
| Contact Finish - Mating | Gold |
| Operating Temperature | - |
| Contact Material - Post | Brass |
| Datasheets | 518 Series Sgl/Dual Solder Pin |
| Current Rating | 3A |
| Termination | Solder |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 2 (1 x 2) |
| Standard Package | 1 |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Series | 518 |
| Type | DIP, 0.2" (5.08mm) Row Spacing |
| Contact Finish - Post | Tin |
| Packaging | Bulk |
| Part Status | Active |
| Family | Sockets for ICs, Transistors |
| Contact Material - Mating | Beryllium Copper |
| Termination Post Length | 0.125" (3.18mm) |
