| Number of Channels per Chip | 4 |
| Minimum Common Mode Rejection (kV/us) | 25 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| PCB changed | 16 |
| Output Type | CMOS |
| ECCN (US) | EAR99 |
| Maximum Quiescent Supply Current (mA) | 1.3/1.2 |
| Maximum Data Rate | 150Mbps |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 105 |
| Maximum Pulse Width Distortion (ns) | 2 |
| Supplier Package | SOIC W |
| Package Height | 2.35(Max) |
| Maximum Operating Supply Voltage (V) | 5.5 |
| EU RoHS | Compliant |
| Maximum Working Insulation Voltage | 560Vp |
| Maximum Rise Time (ns) | 3(Typ) |
| Maximum Propagation Delay Time (tPHL) (ns) | 32 |
| Maximum Fall Time (ns) | 3(Typ) |
| Package Length | 10.5(Max) |
| Standard Package Name | SOP |
| Pin Count | 16 |
| Forward/Reverse Channels | 3/1 |
| Mounting | Surface Mount |
| Type | General Purpose |
| Coupling Type | Magnetic Coupling |
| Lead Shape | Gull-wing |
| Part Status | NRND |
| Minimum Pulse Width (ns) | 6.67 |
| Packaging | Tape and Reel |
| Maximum Propagation Delay Time (tPLH) (ns) | 32 |
| Package Width | 7.6(Max) |
| Maximum Propagation Delay Skew (ns) | 12 |
| Minimum Operating Supply Voltage (V) | 3 |
