Fabrication Technology | 130nm |
Program Memory Type | SRAM |
Maximum Number of SERDES Channels | 30 |
Single-Ended I/O Standards Supported | LVTTL|LVCMOS |
Package Width (mm) | 29 |
Maximum Number of User I/Os | 615 |
Differential I/O Standards Supported | LVPECL|LVDS|PCML |
Minimum Operating Temperature (°C) | 0 |
Dedicated DSP | 14 |
Maximum Operating Temperature (°C) | 85 |
Supplier Package | FC-FBGA |
Device Logic Units | 41250 |
印刷电路板已变更 | 780 |
RAM Bits | 3343.5 |
Supported IP Core Manufacture | Microtronix Inc/CAST, Inc/Northwest Logic, Inc/IFI/Digital Core Design/PLDA |
Family Name | Stratix® |
Maximum Operating Supply Voltage (V) | 1.575 |
Main Family Name | Stratix |
Package Height (mm) | 3(Max) |
External Memory Interface | DDR SDRAM|FCRAM|QDR II+SRAM|ZBT SRAM |
Device Number of DLLs/PLLs | 12 |
Number of Multipliers | 112 (9x9) |
Device Logic Cells | 41250 |
Standard Package Name | BGA |
Pin Count | 780 |
Mounting | Surface Mount |
欧盟限制某些有害物质的使用 | Not Compliant |
Package Length (mm) | 29 |
Lead Shape | Ball |
Typical Operating Supply Voltage (V) | 1.5 |
Maximum Internal Frequency (MHz) | 420.17 |
Supported IP Core | Video LVDS SerDes Transmitter / Receiver|PCI Express Cores|IFI Advanced CAN IP|DI2CSB I2C Bus Inter |
Temperature Grade | Commercial |
Programmability | No |